Corning's latest glass substrates for the semiconductor industry is an enhanced line of glass carrier wafers optimized for fan-out processes.

The Advanced Packaging Carriers are...

Samsung's device Solution (DS) division, which oversees the semiconductor business, is building R&D for Fan-Out & Wafer-Level Package (Fo-WLP) and pilot lines.

The company's...

Samsung Electro-Mechanics (SEMCO) is reportedly developing fan-out panel-level packaging (FOPLP) technology for the production of application processors (AP) for use in wearable devices since 2018....

Samsung Electronics will reportedy develop its own semiconductor packaging process in 2018, as the company is trying to win back foundry orders for Apple's...

South Korean semiconductor package company NEPES has commercialized Fan-out panel-level packaging (FOPLP) technology, one of the more controversial topics being discussed in the advanced...

Samsung Electro-Mechanics plans to commercialize FoPLP (Fan-out Panel Level Package) semiconductor packaging technology in the first half of 2017.

FoPLP is a...