Fan-out packaging

Corning Introduces Advanced Packaging Carriers Optimized for Fan-out Processes

Jan 22,2019 0 ant

Corning's latest glass substrates for the semiconductor industry is an enhanced line of glass carrier wafers optimized for fan-out processes.

The Advanced Packaging Carriers are...

Samsung Plans to Release First Fo-WLP Chips Next Year

Nov 26,2018 0 ant

Samsung's device Solution (DS) division, which oversees the semiconductor business, is building R&D for Fan-Out & Wafer-Level Package (Fo-WLP) and pilot lines.

The company's...

Samsung to Bring FOPLP Tech to Chips For Wearables

Oct 29,2018 0 antadmin

Samsung Electro-Mechanics (SEMCO) is reportedly developing fan-out panel-level packaging (FOPLP) technology for the production of application processors (AP) for use in wearable devices since 2018....

TSMC Tapes out First 5nm Chip, Outlines Packaging Techniques

Oct 4,2018 0

TSMC has taped out its first chip in a process that partially makes use of extreme ultraviolet lithography (EUV) and will start risk production in...

Samsung to Develop Its Own Fo-WLP Chip Packaging Process

Dec 28,2017 0

Samsung Electronics will reportedy develop its own semiconductor packaging process in 2018, as the company is trying to win back foundry orders for Apple's...

Korean NEPES First to Commercialize Fan-out panel-level Packaging (FOPLP) Technology

May 14,2017 0

South Korean semiconductor package company NEPES has commercialized Fan-out panel-level packaging (FOPLP) technology, one of the more controversial topics being discussed in the advanced...

Samsung to Develop New FoPLP Prototype

Nov 25,2016 0

Samsung Electro-Mechanics plans to commercialize FoPLP (Fan-out Panel Level Package) semiconductor packaging technology in the first half of 2017.

FoPLP is a...

Samsung Electro-mechanics Readies Fan-out Chip Packaging

Jul 5,2016 0

Electronic parts supplier Samsung Electro-mechanics Co. will realign its business focus to camera, IT modules and semiconductor packaging, having completed a year-long streamlining. The company...