Intel Unveils the Future Of Core, New GPUs, 3D Packaging With 'Foveros'
Intel demonstrated a new 3D packaging technology for face-to-face stacking of logic, scheduled to be available in the second half of next year. The company...
Intel demonstrated a new 3D packaging technology for face-to-face stacking of logic, scheduled to be available in the second half of next year. The company...
Intel today named academic, government and corporate research groups participating in its Intel Neuromorphic Research Community (INRC) and discussed research progress from the inaugural INRC...
Although we have not yest seen an actual Intel chip made using a 10nm process, Intel says that the lessons learned from the 10nm process...
Liqid is demonstrating Liqid and Intel Optane solid state drive solutions that combine high throughput, low latency, quality of service (QoS) and endurance of Intel...
With HOOBOX Robotics’ Wheelie 7 kit powered by Intel artificial intelligence (AI) technologies, people can control their motorized wheelchairs with simple facial expressions.
Taking...
Intel researcers have invented a "magneto-electric spin-orbit" (MESO) logic device, which has the potential to lower voltage by 5 times and energy by 10-30 times...
Intel has been granted a patent for developing an energy-efficient bitcoin mining process which is said to cut overall power consumption by 15%.
Intel...
Intel sees its 30-year chipmaking dominance unde threat, as the PC market shrinks and Taiwan Semiconductor Manufacturing Co (TSMC) keeps moving on to te development...
Microsoft is moving to a new Universal Drivers architecture starting with Windows 10 October 2018 Update,and Intel has released the first version of...
x86 continues to be the mainstream architecture for server CPUs this year, with Intel and AMD being the market leaders.
According to DRAMeXchange, a division...