Renesas Electronics today announced the availability of the MP5232, the first single-chip smartphone platform optimised to address the US$150-300 range device market. The MP5232 platform...

Renesas Electronics Corp, Fujitsu Ltd and Panasonic Corp have begun discussions toward integrating their system chip operations, according to a report Tuesday by Japan's Nikkei...

Renesas Electronics' SuperSpeed USB (USB 3.0) SATA3 bridge system-on-chip (SoC), part number, µPD720230, has passed the certification testing by the USB Implementers Forum (USB-IF).

Renesas...

Renesas is demonstrating its high performance 3D mobile platform, the MP5225, for Android-based smartphones at 4G World 2011 in Chicago (24-27 October, Renesas Mobile Stand...

Renesas Electronics today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) SATA3 bridge system-on-chip that enables data transfer between a USB3.0...

Renesas Electronics today announced the availability of its new LED driver IC, the R2A50106FT, for LED backlights in LCD TVs with 20 percent reduced power...

Renesas Electronics and TELEFUNKEN Semiconductors GmbH & Co. KG today announced that they have signed an agreement under which Renesas Electronics America Inc. will sell...

Renesas Electronics (formerly NEC Electronics) today announced the availability of its two new SuperSpeed Universal Serial Bus (USB 3.0) xHCI host controllers for electronic devices...

Renesas Mobile and Finnish software company Nomovok Ltd. will showcase at Mobile World Congress (MWC) 2011 the first MeeGo 1.1 implementation on a Renesas Mobile's...

Renesas Electronics today announced the availability of a new system-on-chip (SoC), the CE150, for smartphones and high-end mobile phones that delivers resolution of 16 megapixels...