Intel Unveils the Future Of Core, New GPUs, 3D Packaging With 'Foveros'
Intel demonstrated a new 3D packaging technology for face-to-face stacking of logic, scheduled to be available in the second half of next year. The company...
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Intel demonstrated a new 3D packaging technology for face-to-face stacking of logic, scheduled to be available in the second half of next year. The company...