today announced a scientific breakthrough using standard silicon manufacturing processes to create the world's first continuous wave silicon laser This technology could help bring low-cost,...
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has produced the world's first DDR3 DRAM (dynamic random access...
Toshiba introduced a featured configuration (Tecra A4-S211) and a series of scalable options for the Tecra(R) A4 notebook series. The Tecra A4 can be configured...
Toshiba introduced the Tecra(R) S2 notebook series, the company's scalable, high-performance desktop replacement mobile computing solution. Toshiba's newest addition to the Tecra notebook family is...
Toshiba established a new standard for business mobility with the introduction of the Tecra(R) M3 notebook series. An extension of Toshiba's flagship business notebook line,...
Corsair Memory announced immediate availability of a new line of DDR2 PC2-4200 SO-DIMMs designed to support Intel's newest mobile computing platform. Corsair's three new SO-DIMM...
Intel has added performance-enhancing cache memory to its server-focused Xeon processor range, and outlined plans for its next-generation server platforms including dual-core processors. The new...
Silicon Integrated Systems (SiS) has signed a licensing agreement with Intel that will allow SiS to produce chipsets supporting front-side bus (FSB) speeds up to...
Hitachi, in cooperation with Elpida Memory, Inc. announced that they have developed a new methodology for memory-array design, Concordant Memory Design Using Statistical Integration, which...