Qualcomm Technologies, Inc. announced the new Snapdragon® 888 Plus 5G Mobile Platform, a follow-on to the flagship Snapdragon 888. These two platforms power more than...

SoftBank in Japan has announced a Leica-branded phone for the Japanese market, the Leitz Phone 1. This is not Leica's first foray into the smartphone...

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing its latest smartphone memory solution, the LPDDR5 UFS-based...

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced the industry’s first 0.64-micrometer (μm)-pixel image sensor, the 50-megapixel (Mp) Samsung ISOCELL JN1. Equipped...

In today’s fast-paced world, users always need to have their smartphone cameras at the ready so they can quickly capture those precious, fleeting memories in...

Qualcomm Technologies, Inc. today debuted the Qualcomm® Snapdragon™ 7c Gen 2 compute platform, the second generation of the Company’s breakthrough entry-level platform for always on,...

Qualcomm Technologies, Inc. today announced the Qualcomm® Snapdragon™ Developer Kit, which is designed to enable extended support for independent software vendors and application developers to...

During the annual Qualcomm 5G Summit, Qualcomm Technologies, Inc. announced the new Qualcomm® Snapdragon™ 778G 5G Mobile Platform, which is slated to power upcoming high-tier...

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the industry’s first integrated power management ICs (PMICs) — S2FPD01, S2FPD02 and S2FPC01, for...

Today, Leica Camera AG and Sharp Corporation announced the establishment of a long-term technology partnership and presented the first AQUOS R6 Smartphone ‘co-engineered with Leica’...