AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture
"AMD is a world class semiconductor provider with advanced flip chip packaging and test technologies. These capabilities are complementary with NFME's advanced packaging and test technologies, such as its flip chip and bump technology for the computing, communication and consumer market. The establishment of this joint venture will elevate the competitiveness of NFME's flip chip packaging and test technologies to a world-class level. With this joint venture, NFME's advanced packaging and test capabilities will account for 70 percent of its total revenue, leading the entire industry and ranking among the top packaging and test companies in the world," said Chairman of Nantong Fujitsu Mr. Shi Mingda.
Key highlights of the deal include:
- NFME's affiliates have purchased an 85 percent share of AMD's Penang, Malaysia and Suzhou, China ATMP operations and act as controlling partner for the new joint venture business.
- AMD received from NFME approximately $371 million, excluding purchase price adjustments, with net cash proceeds of approximately $320 million after payment of taxes and other customary expenses. AMD retains a 15 percent ownership of the Penang and Suzhou operations.
- The transaction is expected to be cost neutral to AMD's P&L while significantly reducing AMD's capital expenditures. AMD will account for its 15 percent ownership stake in the joint venture and its results of operations under the equity method of accounting.
- Approximately 1,700 AMD employees transitioned to the joint venture.