Breaking News

Samsung announces Galaxy XR headset Leica M EV1 – the first M-Camera with an integrated electronic viewfinder Micron Delivers Industry’s Highest Capacity SOCAMM2 for Low-Power DRAM in the AI Data Center KIOXIA launches EXCERIA PLUS G3 and EXCERIA G3 microSD cards for exceptional photography and video performance CORSAIR Adds Rugged Performance and Mobile Convenience to Its Storage Portfolio

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture

AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture

Enterprise & IT Apr 29,2016 0

AMD and Nantong Fujitsu Microelectronics Co., Ltd. (NFME) today announced that they have closed the transaction to create a joint venture offering differentiated assembly, test, mark, and pack (ATMP) capabilities to both AMD and a broader range of customers. "Combining AMD's world-class teams and facilities in Penang and Suzhou with NFME's expertise in the growing assembly and test market will create a new outsource assembly and test leader with the scale and capabilities to help us deliver our upcoming high-performance technologies and products that can re-shape the industry," said AMD President and CEO Dr. Lisa Su. "The creation of this joint venture marks another step in building a more focused AMD as we complete our transition to a fabless business model, enhance our supply chain operations, and further strengthen our financial position."

"AMD is a world class semiconductor provider with advanced flip chip packaging and test technologies. These capabilities are complementary with NFME's advanced packaging and test technologies, such as its flip chip and bump technology for the computing, communication and consumer market. The establishment of this joint venture will elevate the competitiveness of NFME's flip chip packaging and test technologies to a world-class level. With this joint venture, NFME's advanced packaging and test capabilities will account for 70 percent of its total revenue, leading the entire industry and ranking among the top packaging and test companies in the world," said Chairman of Nantong Fujitsu Mr. Shi Mingda.

Key highlights of the deal include:

  • NFME's affiliates have purchased an 85 percent share of AMD's Penang, Malaysia and Suzhou, China ATMP operations and act as controlling partner for the new joint venture business.
  • AMD received from NFME approximately $371 million, excluding purchase price adjustments, with net cash proceeds of approximately $320 million after payment of taxes and other customary expenses. AMD retains a 15 percent ownership of the Penang and Suzhou operations.
  • The transaction is expected to be cost neutral to AMD's P&L while significantly reducing AMD's capital expenditures. AMD will account for its 15 percent ownership stake in the joint venture and its results of operations under the equity method of accounting.
  • Approximately 1,700 AMD employees transitioned to the joint venture.

Tags: AMD
Previous Post
HP Releases New Chromebook for Home and Office
Next Post
Google's Pichai Sees the End of Computers

Related Posts

  • ASUS Announces Turbo Radeon AI Pro R9700 32GB Graphics Card

  • AMD Introduces EPYC Embedded 4005 Processors for Low-Latency Applications at the Edge

  • AMD announces Instinct MI350 Series GPUs

  • IBM and AMD Join Forces to Build the Future of Computing

  • AMD Introduces New Radeon Graphics Cards and Ryzen Threadripper Processors at COMPUTEX 2025

  • AMD Announces Press Conference at COMPUTEX 2025

  • ASUS Republic of Gamers Unveils Crosshair X870E Extreme, Apex Motherboards

  • ASRock gives more information about AMD CPUs and their products

Latest News

Samsung announces Galaxy XR headset
Consumer Electronics

Samsung announces Galaxy XR headset

Leica M EV1 – the first M-Camera with an integrated electronic viewfinder
Cameras

Leica M EV1 – the first M-Camera with an integrated electronic viewfinder

Micron Delivers Industry’s Highest Capacity SOCAMM2 for Low-Power DRAM in the AI Data Center
Enterprise & IT

Micron Delivers Industry’s Highest Capacity SOCAMM2 for Low-Power DRAM in the AI Data Center

KIOXIA launches EXCERIA PLUS G3 and EXCERIA G3 microSD cards for exceptional photography and video performance
Cameras

KIOXIA launches EXCERIA PLUS G3 and EXCERIA G3 microSD cards for exceptional photography and video performance

CORSAIR Adds Rugged Performance and Mobile Convenience to Its Storage Portfolio
Consumer Electronics

CORSAIR Adds Rugged Performance and Mobile Convenience to Its Storage Portfolio

Popular Reviews

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

Terramaster F8-SSD

Terramaster F8-SSD

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

be quiet! Pure Base 501

be quiet! Pure Base 501

Soundpeats Pop Clip

Soundpeats Pop Clip

Akaso 360 Action camera

Akaso 360 Action camera

Dragon Touch Digital Calendar

Dragon Touch Digital Calendar

Noctua NF-A12x25 G2 fans

Noctua NF-A12x25 G2 fans

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed