Intel Advances Cloud Efforts with New Collaboration
Intel announced today plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the demand for custom compute solutions for data centers and the cloud.
This collaboration is part of Intels strategy to integrate reprogrammable technology with Intel Xeon processors to provide cloud customers with custom solutions that improve performance, power and cost.
The ASIC designs will be provided by eASIC, a fabless semiconductor company based in Santa Clara, California.
Intel did not comment on the type of ASICs being integrated, or when they will be integrated in Xeon chips.
Intel is already designing custom server chips with different types of I/O, memory and storage controllers. Intel is planning to also integrate FPGA (field-programmable gate array) reprogrammable circuits in its server chips. ASICs will be more power-efficient at specific tasks than traditional FPGAs, Intel said.
The ASIC designs will be provided by eASIC, a fabless semiconductor company based in Santa Clara, California.
Intel did not comment on the type of ASICs being integrated, or when they will be integrated in Xeon chips.
Intel is already designing custom server chips with different types of I/O, memory and storage controllers. Intel is planning to also integrate FPGA (field-programmable gate array) reprogrammable circuits in its server chips. ASICs will be more power-efficient at specific tasks than traditional FPGAs, Intel said.
