Altera and TSMC today announced a technology collaboration using TSMC?s 55nm Embedded Flash (EmbFlash) process technology. Programmable devices based on TSMC's 55nm EmbFlash target a...
Altera and TSMC today announced the joint development of the first heterogeneous 3D IC test vehicle using TSMC?s Chip-on-Wafer-on-Substrate (CoWoS) integration process. Heterogeneous 3D ICs...