Europe's ExaNoDe Project Builds 3DIC Exascale Compute Node
After three years of development, the European Exascale Processor Memory Node Design (ExaNoDe) project has built what it claims is a compute node prototype that...
Chiplet
Arm and TSMC Demonstrate First 7nm Arm-based, 4GHz CoWoS Chiplets for High-Performance Computing
Arm and TSMC today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution.
This...
TSMC to Highlight Innovations in 22nm eMRAM, Transistor Scaling at 3nm and 7nm 4GHz Arm-core-based Design at 2019 Symposia on VLSI Technology & Circuits
TSMC will present papers on its research into emerging memory, two-dimensional materials, and system integration technologies at the 2019 Symposia on VLSI Technology & Circuits,...
AMD Presents Modular Routing Design for Chiplet-based Systems
AMD engineers have presented a potential solution for overcoming data routing issues in "chiplets" - a concept in which bare ICs are interconnected on a...
