This week at the IEEE Solid-State Circuits Conference (ISSCC) in San Francisco, French research organization CEA-Leti showed a a 96-core processor made out of six...

After three years of development, the European Exascale Processor Memory Node Design (ExaNoDe) project has built what it claims is a compute node prototype that...

Arm and TSMC today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution.

This...

TSMC will present papers on its research into emerging memory, two-dimensional materials, and system integration technologies at the 2019 Symposia on VLSI Technology & Circuits,...