CEA-Leti Presents High-Performance, 96-Core Processor Made of Chiplets
This week at the IEEE Solid-State Circuits Conference (ISSCC) in San Francisco, French research organization CEA-Leti showed a a 96-core processor made out of six...
TEAMGROUP Leads the Industry with The Announcement of High-Performance CAMM2 DDR5 Memory ASUS Announces TUF Gaming A2 SSD Enclosure Introducing The Razer Viper V3 Pro Sentinels Edition Noctua presents NF-A6x15 60mm fans and NA-SC1 Sx2 splitter cable set TCL Extends Partnership with Activision to Launch Call of Duty: Black Ops 6 and Enhance the Gaming Experience for Players Worldwide
This week at the IEEE Solid-State Circuits Conference (ISSCC) in San Francisco, French research organization CEA-Leti showed a a 96-core processor made out of six...
After three years of development, the European Exascale Processor Memory Node Design (ExaNoDe) project has built what it claims is a compute node prototype that...
Arm and TSMC today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution.
This...
TSMC will present papers on its research into emerging memory, two-dimensional materials, and system integration technologies at the 2019 Symposia on VLSI Technology & Circuits,...