CEA-Leti Presents High-Performance, 96-Core Processor Made of Chiplets
This week at the IEEE Solid-State Circuits Conference (ISSCC) in San Francisco, French research organization CEA-Leti showed a a 96-core processor made out of six...
Europe's ExaNoDe Project Builds 3DIC Exascale Compute Node
After three years of development, the European Exascale Processor Memory Node Design (ExaNoDe) project has built what it claims is a compute node prototype that...
Arm and TSMC Demonstrate First 7nm Arm-based, 4GHz CoWoS Chiplets for High-Performance Computing
Arm and TSMC today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution.
This...
TSMC to Highlight Innovations in 22nm eMRAM, Transistor Scaling at 3nm and 7nm 4GHz Arm-core-based Design at 2019 Symposia on VLSI Technology & Circuits
TSMC will present papers on its research into emerging memory, two-dimensional materials, and system integration technologies at the 2019 Symposia on VLSI Technology & Circuits,...
AMD Presents Modular Routing Design for Chiplet-based Systems
AMD engineers have presented a potential solution for overcoming data routing issues in "chiplets" - a concept in which bare ICs are interconnected on a...
