GLOBALFOUNDRIES today unveiled details of a collaborative project to deliver next-generation chip packaging technologies. The company, in partnership with Open-Silicon (chief architect) and Amkor Technology,...

Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition...

Reports have been circulating online this week related to talks between Apple and chip maker Globalfoundries, possibly as part of Apple's moves to guarantee access...

China fabless semiconductor company Rockchip has released new mobile processors based on GLOBALFOUNDRIES’ 28nm High-K Metal Gate (HKMG) process technology. Based on a multi-core ARM...

GLOBALFOUNDRIES will unveil a set of certified design flows to support its most advanced manufacturing processes at next week's 50th Design Automation Conference (DAC) in...

Globalfoundries today joined a collaborative research program run by European research institute IMEC on STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology. The first IC...

Infineon Technologies and GLOBALFOUNDRIES today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. The cooperation will...

At its Fab 8 campus in Saratoga County, N.Y., GLOBALFOUNDRIES today demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs). ...

Brion Technologies, a division of ASML, on Monday announced a partnership with GLOBALFOUNDRIES to deliver high volume computational lithography capabilities for 28 nm and 20...

GLOBALFOUNDRIES today announced additional enhancements to the foundry's 55-nanometer (nm) Low-Power Enhanced (LPe) process technology platform - 55nm LPe 1V - with next-generation memory and...