GLOBALFOUNDRIES Demonstrates Model for Next-Generation Chip Packaging Technologies
GLOBALFOUNDRIES today unveiled details of a collaborative project to deliver next-generation chip packaging technologies.
The company, in partnership with Open-Silicon (chief architect) and Amkor Technology, Inc. (assembly and test), jointly exhibited a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.
The jointly developed design is a test vehicle that showcases the benefits of 2.5D technology for mobile and low-power server applications.
"As the fabless-foundry business model evolves to address the realities of today?s dynamic market, foundries are taking on increasing responsibility for enabling the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs," said David McCann, vice president of packaging R&D at GLOBALFOUNDRIES. "To help address these challenges, we are driving our 'Foundry 2.0' collaborative supply chain model by engaging early with ecosystem partners like Open-Silicon and Amkor to jointly develop solutions that will enable the next wave of innovation in the industry."
The test vehicle features two ARM Cortex-A9 processors manufactured using GLOBALFOUNDRIES' 28nm-SLP (Super Low Power) process technology. The processors are attached to a silicon interposer, which is built on a 65nm manufacturing flow with through-silicon-vias (TSVs) to enable high-bandwidth communication between the chips.
Open-Silicon provided the processor, interposer, substrate, and test design, as well as the test and characterization of the final product. GLOBALFOUNDRIES provided the PDKs, interposer reference flow and manufactured both the 28nm ARM processors and the 65nm silicon interposer with embedded TSVs. Amkor provided the package-related design rules and manufacturing processes for back-side integration, copper pillar micro-bumping, and 2.5D product assembly. GLOBALFOUNDRIES and Amkor collaborated throughout the project to develop and validate the design rules, assembly processes, and required material sets.
The companies demonstrated first-time functionality of the processor, interposer, and substrate designs, and said that the die-to-substrate (D2S) process used by the supply chain resulted in high yields.
The jointly developed design is a test vehicle that showcases the benefits of 2.5D technology for mobile and low-power server applications.
"As the fabless-foundry business model evolves to address the realities of today?s dynamic market, foundries are taking on increasing responsibility for enabling the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs," said David McCann, vice president of packaging R&D at GLOBALFOUNDRIES. "To help address these challenges, we are driving our 'Foundry 2.0' collaborative supply chain model by engaging early with ecosystem partners like Open-Silicon and Amkor to jointly develop solutions that will enable the next wave of innovation in the industry."
The test vehicle features two ARM Cortex-A9 processors manufactured using GLOBALFOUNDRIES' 28nm-SLP (Super Low Power) process technology. The processors are attached to a silicon interposer, which is built on a 65nm manufacturing flow with through-silicon-vias (TSVs) to enable high-bandwidth communication between the chips.
Open-Silicon provided the processor, interposer, substrate, and test design, as well as the test and characterization of the final product. GLOBALFOUNDRIES provided the PDKs, interposer reference flow and manufactured both the 28nm ARM processors and the 65nm silicon interposer with embedded TSVs. Amkor provided the package-related design rules and manufacturing processes for back-side integration, copper pillar micro-bumping, and 2.5D product assembly. GLOBALFOUNDRIES and Amkor collaborated throughout the project to develop and validate the design rules, assembly processes, and required material sets.
The companies demonstrated first-time functionality of the processor, interposer, and substrate designs, and said that the die-to-substrate (D2S) process used by the supply chain resulted in high yields.
