Mushkin XP2-6400

1. Introduction

Review Pages

1. Introduction
2. Test System - Configuration
3. SiSoftware Sandra 2005
4. PCMark05
5. Performance Test v5.0
6. Half Life 2
7. Conclusion

Mushkin was founded in 1994. It has been active in the memory market and is one of the better known manufacturers in the overclocking community as well as with most users interested in pushing their systems to the limits, who choose Mushkin memory modules because of their quality and performance.

The eXtreme Performance 512M XP2-6400 module (DDR2-800) offers second generation enhanced memory throughput and stability for the most extreme DDR2 computing platforms. A product of Mushkin's exclusive EPIC (Enhanced Performance IC) selection process, the XP2-6400 is hand-tested to the highest quality and performance standards.

The module is an unbuffered 240-Pin Double Data Rate x2 (DDR2) Synchronous DRAM Dual In-Line Memory Module (DIMM), organized as a single-bank, 64Mx64 high speed memory array using 64Mx8 chip density. This DIMM achieves high-speed data transfer rates of 800MHz at latencies of 4-4-3-10 (CAS-TRCD-TRP-TRAS).

The XP2-6400 is enhanced by Mushkin's Frostbyte heatspreader to ensure superior thermal performance and system reliability. With extreme performance and Mushkin's renowned reliability, the XP2-6400 is the memory upgrade of choice for those DDR2 enthusiasts demanding more out of their high-performance system.

It is fact that the industry is moving towards DDR2 memory. The largest slice of the market belongs to Intel and AMD based systems. Until now however, only Intel has supported DDR2 memory while AMD, is about to release its new platform with DDR2 support. As a result, most memory manufacturers have already started to offer higher memory speeds with lower timings.

We received Mushkin's XP2-6400 dual channel kit of 2x512MB, for our review.

The new XP2-6400 memory has the aluminium heatspreaders, a trademark of Mushkin modules, which help in heat dissipation and allow for greater ventilation. Notice the gap, shown in the screenshot below, between the memory chips and the heatspreaders.