Intel CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. Intel introduced the Intel Atom x3 processor series (formerly code-named "SoFIA"), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset.

The Intel Atom x3 processor family includes:

• Intel Atom x3- C3130, a dual-core platform with an Intel Atom processor integrated with a 3G modem
• Intel Atom x3-C3230RK, a quad-core platform with an Intel Atom processor integrated with a 3G modem, manufactured by Intel’s development partner, Rockchip
• Intel Atom x3 - C3440, a quad-core platform with an Intel Atom processor integrated with an LTE modem

The Intel Atom x3 processor includes a quad-core or dual-core Intel architecture processor at up to 1.4 GHz burst mode, clear graphics and video, high-quality audio, and dual cameras, including an up to a 5-megapixel front camera and a 13-megapixel rear-facing camera.

The Atom x3-C3440 processor combines the fast downloads peeds of LTE technology with worldwide roaming enabled by the integrated Intel modem. The modem supports 14 LTE bands in a single SKU, providing single-chip carrier aggregation up to 40MHz, CAT6 speeds,
and LTE TDD and FDD modes. The processor also supports up to OpenGL ES 3.0 (graphics).

In addition, the platform provides quality audio in any environment, with noise reduction (single and dual-microphone, traffic, wind, and ambient noise), echo cancellation, dynamic range processing and ambient noise adaptation.

Connectivity capabilities include Wi-Fi, Bluetooth and global navigation satellite system (GNSS). Dual SIM capability enables two cellular subscriptions from different carriers. Last but not least, the built-in FM radio lets people listen to audio broadcasts without incurring subscription service charges for music or other content.

Twenty companies, including ASUS and Jolla, plan to deliver Intel Atom x3 designs.

Intel also extended its Intel Wireless portfolio with the addition of three new products for mobile platforms:

• Intel Wireless-AC 8x70, Intel Wireless-GNSS 2x00 and Intel Wireless-NFC 4000.
• The new mobile connectivity technologies accommodate a range of tablet, phablet and smartphone form factors across various market segments.

The new Intel Wireless connectivity products are pre-integrated with Intel XMM 726x and Intel XMM 7360 LTE modems and are pre-integrated
with the Intel Atom x3- C3344 processor. They will also be offered in combination with future Intel Atom processors, and as discrete solutions.

Intel also introduced its first 14nm Intel Atom SoC, the Intel Atom x5 and x7 processor series (formally code-named "Cherry Trail") for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows and Android, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also "conflict-free", meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

The new SoC offers 64-bit computing, up to two times 3D graphics improvement generation-over-generation with Intel Generation 8 graphics, great performance and long battery life.

The Intel Atom x5 and x7 processors support both Intel RealSense snapshot (R100) and Intel RealSense 3D camera (R200). Intel RealSense snapshot (R100), available now, enables depth-sensing photo capabilities by allowing users to change focus, take measurements and add dynamic effects and motion with the touch of a finger.

The Intel RealSense 3D camera (R200), available in second half of 2015 in tablets, allows consumers to capture the world in 3D including objects, people and environments. It offers enhanced photography with instant dimensions, 3D video capture, background subtraction and advanced image edits.

The platform also enables tablets to wirelessly display content to a big screen or projector. When paired with Intel’s Wi-Fi solutions and the Windows OS, the platform has the option to support Pro WiDi for the enterprise.

With True Key, the user is the password. Consumers can download the app across their devices and instantly log in to apps and websites using things that are unique to the users, such as facial features, the devices they own or a fingerprint. True Key is currently available through a limited release and will be generally available later this year.

Krzanich showed a sneak peak of the Dell Venue 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

Acer, ASUS, Dell, HP, Lenovo and Toshiba, will deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Krzanich announced new customers including Brightstar Corp., Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs.

Intel XMM 7360 features

• LTE Broadcast (eMBMS) for multicast video and content services
• Carrier aggregation support across TDD and FDD spectrum
• Pre-integrated with Intel Atom processors
• Power-efficient Voice over LTE (VoLTE)
• LTE/Wi-Fi interworking and co-existence
• Dual-SIM support
• 5-mode operation, including LTE-FDD, LTE-TDD and TD-SCDMA for world markets
• Scalable RF solution with support for up to 29 LTE bands for global coverage and roaming
• All major carrier aggregation combinations fully supported
• Flexible RF architecture to customize devices to operators' unique geographic requirements
• Tested and pre-validated with operators for rapid device integration and fast time to market

At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security from Intel Security available on the LG Watch Urbane LTE, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed.

Krzanich also outlined how Intel is working with industry to transform network infrastructure with standardized hardware and software.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel Xeon processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere.