Intel New Superchip To Implement InfiniBand Interconnect Technology
Intel has been developing a superchip for high-performance computing systems, which will take advantage of the InfiniBand Interconnect I/O technology.
The superchip is expected to provide high-bandwidth throughput with the use of InfiniBand interconnect technology, said Diane Bryant, vice president and general manager for the datacenter and connected systems group.
InfiniBand is low-latency interconnect technology that links servers and storage units in data centers. Integrating InifiniBand into a chip would make it easier to construct high-performance systems with low latency. The integration of InfiniBand in future MIC chips could give Intel a way to create dense fabric for high-performance interconnects in supercomputers.
Intel last January acquired assets of Qlogic's InfiniBand business, which the chip maker said would enhance its networking portfolio and provide scalable high- performance computing (HPC) fabric technology. It would also support the Intel's vision of innovating on fabric architectures to achieve ExaFLOP/s performance by 2018.
InfiniBand is low-latency interconnect technology that links servers and storage units in data centers. Integrating InifiniBand into a chip would make it easier to construct high-performance systems with low latency. The integration of InfiniBand in future MIC chips could give Intel a way to create dense fabric for high-performance interconnects in supercomputers.
Intel last January acquired assets of Qlogic's InfiniBand business, which the chip maker said would enhance its networking portfolio and provide scalable high- performance computing (HPC) fabric technology. It would also support the Intel's vision of innovating on fabric architectures to achieve ExaFLOP/s performance by 2018.
