SK Hynix Presents HBM3 DRAM
SK hynix's HBM3 uses over 8,000 TSVs per stack (i.e. over 100,000 TSVs in a 12-Hi stack) and can feature up to 12-Hi stack, which...
SK hynix's HBM3 uses over 8,000 TSVs per stack (i.e. over 100,000 TSVs in a 12-Hi stack) and can feature up to 12-Hi stack, which...
Kioxia Corporation, a world leader in memory solutions, today announced that it has started sampling[1] new Automotive Universal Flash Storage[2] (UFS) Ver. 3.1 embedded flash...
Fujitsu has successfully developed the world's fastest quantum computer simulator capable of handling 36 qubit quantum circuits on a cluster system featuring Fujitsu's "FUJITSU Supercomputer...
Samsung Electronics Co., Ltd. and Western Digital (Nasdaq: WDC) today announced that they have signed a memorandum of understanding (MOU) for a unique collaboration to...
TEAMGROUP is leading the DDR5 evolution with its leading-edge R&D capabilities. In addition to the overclocking DDR5 gaming memory market, the company has set its...
GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced participation in KDDI’s one-phase immersion cooling proof of concept that demonstrates...
Samsung Electronics today announced its latest Smart Monitor series, the M8, featuring an upgraded, stylish design. The versatile new M8 delivers Samsung’s iconic slim design...
Your precious eyes may be hurt if you spend a long time being glued to the screen while working, and binge-watching TV series after work....
BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest TB560-BTC PRO mining motherboard. Designed to support Intel is 10th/11th...
ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered...