Hynix today announced the industry's first 2Gb(Gigabit) GDDR5 using its 40nm class process technology. The newly developed GDDR5 is the fastest and highest density graphics...
Intel announced new Intel Atom processors today that feature integrated graphics built directly into the CPU, enabling improved performance and smaller, more energy-efficient designs in...
Panasonic developed a 18650-type high-capacity 3.1 Ah lithium-ion battery and began mass production of the battery this December. The new 3.1 Ah battery has a...
WD and NEC have collaborated to promote the new SuperSpeed Universal Serial Bus (USB) 3.0 standard, a next-generation interface to be used in a wide...
At a press event in San Francisco today, Intel officially disclosed that it be showcasing 32nm Westmere chips at January's Consumer Electronics Show 2010 in...
LaCie, in collaboration with Symwave today announced the industrys first dual hard disk RAID storage solution based on the new SuperSpeed USB (3.0) standard. LaCies...
Recent findings from DisplaySearch research firm indicate that touch and 3D functionality are influencing the development of notebook PC and LCD monitor panels for 2010...
Elpida Memory, Japan's global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 65nm XS extra-shrink version 1-Gigabit...
The Federal Trade Commission today sued Intel charging that the company has illegally used its dominant market position for a decade to stifle competition and...