ULi's M1697 is the company's latest high-definition single-chip solution to empower PCI Express AMD64-based PC systems for sockets 754, 939, 940 and M2 processors. The...

Chip makers are currently focusing on new metrails other than silicon, that will allow their chips to operate faster and they will consume less energy...

In papers presented at the International Electron Devices Meeting (IEDM) in Washington, D.C., IBM and AMD today detailed their progress in bringing advanced semiconductor process...

Toshiba and Sony today announced the development of essential technologies for system LSI based on next-generation 45-nanometer process technology. The advances cover the development of...

Fujitsu has developed a carbon nanotube-based package of heatsinks for semiconductor chips. The company plans to use them in high-frequency, high power amplifiers for next-generation...

ATI introduced the Mobility Radeon X1600 graphics processor for notebooks, featuring ATI's Avivo technology and support for Microsoft's Shader Model 3.0 and DirectX 9c. Mobility...

Teac launches its new line of External 1.8-Inch Mobile USB 2.0 Hard Disk Drives in 20GB, 40GB and 60GB capacities. TEAC's 1.8-Inch Mobile Hard Disk...

The sample we received from Intel this time was the 650, running at 3.4GHz.

MSI launches the new K8NGM2 supporting the latest C51 Nvidia chipset. The board utilizes the latest nForce4 chipset supporting the GeForce 6150/6100 integrated graphics. It...

Corsair send us their latest pair of memory modules, designed and tested to work in Dual Channel mode, with a added size of 2048MB (1024MB per module). These memory modules come from the Corsair "Platinum Series" and use a large heat spreader that lies on the chipsets.