A Korean research team headed by Prof. Hwang Hyeon-sang at Gwangju Institute of Science and Technology has developed core technologies for resistance random access memory,...

In an press event in Japan, former senior vice president of Intel's digital Enterprises division Putt Gelsinger talked about the company's platform strategy for the...

Following the introduction of its 8GB R-DIMM in October, Samsung has now increased the density of its Fully Buffered Dual In-line Memory Module product line-up...

Gigabyte released the i-Cool, a utility that allows PC users to control the CPU performance and fan noise of their PCs. The utility allows users...

VIA Technologies today announced the VIA CN700 IGP chipset to support the VIA C7 processor-powered devices. The integrated S3 Graphics UniChrome Pro IGP core offers...

ULi's M1697 is the company's latest high-definition single-chip solution to empower PCI Express AMD64-based PC systems for sockets 754, 939, 940 and M2 processors. The...

Chip makers are currently focusing on new metrails other than silicon, that will allow their chips to operate faster and they will consume less energy...

In papers presented at the International Electron Devices Meeting (IEDM) in Washington, D.C., IBM and AMD today detailed their progress in bringing advanced semiconductor process...

Toshiba and Sony today announced the development of essential technologies for system LSI based on next-generation 45-nanometer process technology. The advances cover the development of...

Fujitsu has developed a carbon nanotube-based package of heatsinks for semiconductor chips. The company plans to use them in high-frequency, high power amplifiers for next-generation...