Breaking News

Qualcomm Challenges Intel With New Chips, Unveils New XR Platform Samsung Galaxy S11 to Come With a 108-megapixel Camera Europe Won't Accept Private Digital Currencies Ford to Convert and McDonald’s Coffee Bean Skin into Car Parts Snap and Gucci Unveil Limited-edition 3D Spectacles

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

JEDEC to Enable Standard 3D Models of Electronic Components

JEDEC to Enable Standard 3D Models of Electronic Components

Enterprise & IT Nov 27,2018 0

JEDEC Solid State Technology Association today announced that its JC-11 Mechanical Standardization Committee will be releasing 3D models of new standard modules, packages, and socket outlines in addition to the detailed 2D drawings developed today.

The 3D CAD models will be three-dimensional representations of the two-dimensional mechanical drawings offered by the committee and will be provided in a standard universal format so as to be importable by most common 3D CAD software packages used in the industry.

In addition, the JC-11 committee has developed and published a new standard XML schema under JEP30, which aligns to the recently published JESD30H document to enable software to generate 3D models automatically based on user or database inputs.

“The demand for 3D models in electronics design and manufacturing is set to grow exponentially with the expansion of the Internet of Things and the drive towards Digital Manufacturing through automation. JEDEC is helping to enable this growth through the development of 3D models for our standard designs to complement the 2D drawings offered today and by establishing a universal schema for presenting real part data to software. These resources will greatly reduce time to market, eliminate opportunities for human error, and reduce manufacturing costs across the industry.” said John Norton, JEDEC JC-11 Chairman.

Tags: 3D printersjedec
Previous Post
Sony Patents New Game Cartridge
Next Post
Cisco Sees More IP Traffic in the Next Five Years Than in the History of the Internet

Related Posts

  • HP Introduces New 3D Printing Subscriptions, Services

  • HP Announces New Industrial 3D Printing Solution, Industrial Alliances

  • 3-D Printing Startup Markforged Raises $82 Million

  • Updated LPDDR5 Standard Doubles Memory Throughput of LPDDR4

  • JEDEC Updates The High Bandwidth Memory Standard

  • Researchers Accelerate 3-D Printing

  • Canon Develops Proprietary Ceramic Material for Complex 3D Printing

  • HP Pitches Metal Jet printer

0 Comments

Leave a Reply

More information about text formats

Filtered HTML

  • Web page addresses and e-mail addresses turn into links automatically.
  • Allowed HTML tags: <a> <em> <strong> <cite> <blockquote> <code> <ul> <ol> <li> <dl> <dt> <dd>
  • Lines and paragraphs break automatically.

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.

BBCode

  • No HTML tags allowed.
  • You may use these tags: [abbr], [acronym], [b], [center], [code], [color], [define], [font], [h1], [h2], [h3], [h4], [h5], [h6], [hr], [i], [img], [justify], [left], [list], [node], [php], [quote], [right], [s], [size], [sub], [sup], [u], [url], [wikipedia], [youtube], [align], [link], [ol], [ul]
  • Lines and paragraphs break automatically.
CAPTCHA
This question is for testing whether or not you are a human visitor and to prevent automated spam submissions.
Image CAPTCHA
Enter the characters shown in the image.

Latest News

Qualcomm Challenges Intel With New Chips, Unveils New XR Platform
PC components

Qualcomm Challenges Intel With New Chips, Unveils New XR Platform

Samsung Galaxy S11 to Come With a 108-megapixel Camera
Smartphones

Samsung Galaxy S11 to Come With a 108-megapixel Camera

Europe Won't Accept Private Digital Currencies
Enterprise & IT

Europe Won't Accept Private Digital Currencies

Ford to Convert and McDonald’s Coffee Bean Skin into Car Parts
Enterprise & IT

Ford to Convert and McDonald’s Coffee Bean Skin into Car Parts

Snap and Gucci Unveil Limited-edition 3D Spectacles
Gadgets

Snap and Gucci Unveil Limited-edition 3D Spectacles

Popular Reviews

Zidoo Z9S 4K Media Player review

Zidoo Z9S 4K Media Player review

CeBIT 2005

CeBIT 2005

Club3D HD3850

Club3D HD3850

CeBIT 2006

CeBIT 2006

LiteOn iHBS112 review

LiteOn iHBS112 review

Crucial P1 NVMe 1TB SSD review

Crucial P1 NVMe 1TB SSD review

Hitachi DZ-MV100A DVD Camcorder

Hitachi DZ-MV100A DVD Camcorder

Toshiba Exceria M303 64GB and M501 Exceria Pro 64GB MicroSDXC review

Toshiba Exceria M303 64GB and M501 Exceria Pro 64GB MicroSDXC review

  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed