Qualcomm Announces 64-bit Octa-Core Chipset with Integrated 5 Mode Global LTE
Qualcomm Technologies has added the Qualcomm Snapdragon 610 and 615 chipsets to the Snapdragon 600 tier for high-end mobile computing devices.
Both new chipsets integrate Qualcomm Technologies' 3rd Generation LTE modem, supporting Category 4 data rates for new requirements such as LTE-Broadcast and LTE Dual SIM Dual Active (DSDA). The Snapdragon 610 and 615 chipsets are designed to work with Qualcomm Technologies? RF360 Front End solution. In addition to LTE support, both chipsets also integrate critical 3G technologies, including HSPA+ (up to 42Mbps), CDMA, and TD-SCDMA.
The Snapdragon 615 chipset is the first commercially announced octa-core solution with integrated LTE and 64-bit capabilities, while the Snapdragon 610 chipset supports LTE and 64-bit capabilities using quad-core processing.
The Snapdragon 615, 610 and 410 chipsets also support ARMv8, the latest instruction set for ARM compatible devices. The ARMv8 architecture offers power-efficient implementation while maintaining compatibility with existing 32-bit software.
All three chipsets are pin compatible, including support of the same Qualcomm power management, audio, Wi-Fi, Bluetooth, RF, and RF360 solutions. Scalability also extends to software, with identical software used across each of three chipsets, including 64-bit ARMv8 CPU support. Additionally, each chipset integrates an identical LTE modem, utilizing the same core technology that has already shipped millions of prior chipsets used in handsets and certified by operators across the globe.
Qualcomm Snapdragon 610 and 615 chipsets also feature Qualcomm Technologies' Adreno 405 GPU, bringing an Adreno 400 series GPU from the Snapdragon 800 premium tier to the Snapdragon 600 high-end tier for the first time. The Adreno 405 GPU supports the latest mobile graphics APIs like DirectX 11.2 and Open GL ES3.0 with added support of hardware accelerated geometry shading and hardware tessellation. The Adreno 405 also supports Full Profile Open CL for GPGPU compute, video and image processing. The display engine supports up to Quad High Definition (2560x1600) displays and offers Miracast support for wireless streaming of multimedia content. Wireless content can be sent with efficiency through the use of the embedded H.265 hardware decoder and integrated Qualcomm VIVE 802.11ac Wi-Fi and Bluetooth 4.1 solutions.
Qualcomm Technologies anticipates releasing a Qualcomm Reference Design (QRD) version of the Snapdragon 610 and 615 processors in the fourth quarter of 2014.
The Snapdragon 610 and 615 processors are anticipated to begin sampling in the third quarter of 2014 and the first commercial devices are expected in the fourth quarter of 2014.
At MWC, Qualcomm in cooperation with Ericsson are also conducting live demonstrations of LTE Advanced Category 6 connectivity with download speeds up to 300 Mbps. The demonstrations are conducted using a test device equipped with Qualcomm Technologies? fourth-generation multimode LTE modem - the Qualcomm Gobi 9x35 - on Ericsson network infrastructure.
The Gobi 9x35 modem offers up to 300 Mbps LTE Advanced connections and supports up to 40 MHz wideband carrier aggregation deployments on FDD and TDD networks. Additionally, the Gobi 9x35 is the mobile industry's first commercially announced cellular modem to be manufactured on 20 nm process.
The Snapdragon 615 chipset is the first commercially announced octa-core solution with integrated LTE and 64-bit capabilities, while the Snapdragon 610 chipset supports LTE and 64-bit capabilities using quad-core processing.
The Snapdragon 615, 610 and 410 chipsets also support ARMv8, the latest instruction set for ARM compatible devices. The ARMv8 architecture offers power-efficient implementation while maintaining compatibility with existing 32-bit software.
All three chipsets are pin compatible, including support of the same Qualcomm power management, audio, Wi-Fi, Bluetooth, RF, and RF360 solutions. Scalability also extends to software, with identical software used across each of three chipsets, including 64-bit ARMv8 CPU support. Additionally, each chipset integrates an identical LTE modem, utilizing the same core technology that has already shipped millions of prior chipsets used in handsets and certified by operators across the globe.
Qualcomm Snapdragon 610 and 615 chipsets also feature Qualcomm Technologies' Adreno 405 GPU, bringing an Adreno 400 series GPU from the Snapdragon 800 premium tier to the Snapdragon 600 high-end tier for the first time. The Adreno 405 GPU supports the latest mobile graphics APIs like DirectX 11.2 and Open GL ES3.0 with added support of hardware accelerated geometry shading and hardware tessellation. The Adreno 405 also supports Full Profile Open CL for GPGPU compute, video and image processing. The display engine supports up to Quad High Definition (2560x1600) displays and offers Miracast support for wireless streaming of multimedia content. Wireless content can be sent with efficiency through the use of the embedded H.265 hardware decoder and integrated Qualcomm VIVE 802.11ac Wi-Fi and Bluetooth 4.1 solutions.
Qualcomm Technologies anticipates releasing a Qualcomm Reference Design (QRD) version of the Snapdragon 610 and 615 processors in the fourth quarter of 2014.
The Snapdragon 610 and 615 processors are anticipated to begin sampling in the third quarter of 2014 and the first commercial devices are expected in the fourth quarter of 2014.
At MWC, Qualcomm in cooperation with Ericsson are also conducting live demonstrations of LTE Advanced Category 6 connectivity with download speeds up to 300 Mbps. The demonstrations are conducted using a test device equipped with Qualcomm Technologies? fourth-generation multimode LTE modem - the Qualcomm Gobi 9x35 - on Ericsson network infrastructure.
The Gobi 9x35 modem offers up to 300 Mbps LTE Advanced connections and supports up to 40 MHz wideband carrier aggregation deployments on FDD and TDD networks. Additionally, the Gobi 9x35 is the mobile industry's first commercially announced cellular modem to be manufactured on 20 nm process.
