TSMC Collaborates with National Taiwan University to Develop First 40nm 3D TV Chip
The National Taiwan University and TSMC have successfully developed the world's first 40nm Set-Top Box Soc for free-viewpoint 3D TVs.
The SoC is described as a breakthrough in 3D imaging technology, as it will allow viewers positioned in any location in front of the a 3D TV set to see the displayed 3D image from different angles, just
like when they are seeing a real object.
The National Taiwan University DSP IC Design Laboratory developed a 216fps, 4096x2160p 3DTV Set-Top Box Soc, which was packed by TSMC on a 5.76mm2 die using the 40nm CMOS technology. The chip integrates an MVC decoder and a free-viewpoint view synthesis (FVVS) engine to generate unlimited views for 3DTV and virtual reality systems. The developed 6D FVVS flow and a texture reorder cache provide a 9x to 40.5x higher throughput, saving 93% of system bandwidth, and achieves a 6.6x to 229x improvement in power efficiency.
The National Taiwan University DSP IC Design Laboratory developed a 216fps, 4096x2160p 3DTV Set-Top Box Soc, which was packed by TSMC on a 5.76mm2 die using the 40nm CMOS technology. The chip integrates an MVC decoder and a free-viewpoint view synthesis (FVVS) engine to generate unlimited views for 3DTV and virtual reality systems. The developed 6D FVVS flow and a texture reorder cache provide a 9x to 40.5x higher throughput, saving 93% of system bandwidth, and achieves a 6.6x to 229x improvement in power efficiency.
