Chinese YMTC Introduces 128-Layer 1.33Tb QLC 3D NAND
Yangtze Memory Technologies Co., Ltd (YMTC) announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on a SSD...
DJI Elevates Immersive Drone Flight Experience with New Goggles N3 Greenliant to showcase high Endurance NVMe SSDs at electronica 2024 ADATA Collaborates with Intel and Major Motherboard Brands to Create Smooth Overclocking Experience CORSAIR Releases MP700 ELITE Series PCIe 5.0 M.2 SSD Toshiba Collaborates with PROMISE Technology on Providing the Optimal Data Storage Technology for CERN’s Large Hadron Collider
Yangtze Memory Technologies Co., Ltd (YMTC) announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on a SSD...
Yangtze Memory is still on track to launch its most advanced 128-layer 3D NAND this year, despite the delays in the research and development progress...
Integrated circuit production in China is projected to nearly double between 2018 and 2023, increasing from $23.8 billion to $47 billion, according to market research...
Foxconn Technology will reportedly launch an $9 billion chip-making project in China as tensions intensify between Washington and Beijing.
The Taiwan-based company, formally trading as...
The groundbreaking ceremony for China’s first ‘200mm wafer semiconductor equipment verification line’ was held in Changsha High-tech Zone, Changsha, Hunan Province, late last month.
The...
Although it is...