The groundbreaking ceremony for China’s first ‘200mm wafer semiconductor equipment verification line’ was held in Changsha High-tech Zone, Changsha, Hunan Province, late last month.

The project was undertaken by the research institute affiliated with the China Electronics Technology Association (CETC), the Chinese state-run defense company.

According to Hunan provincial government’s media Hong Wang, this investment would create one line that can test 20 units of 200mm wafer semiconductor equipment at once. It is scheduled for operation in 2021. The annual verification capacity is over 40 units. The second phase investment will add 300mm wafer verification capability. Hunan High-tech Zone expects the annual output to exceed 160 billion Won.

The investment will reach the 2.5 billion yuan adn includes the construction of the National IC Industry Technology Innovation Center, Market Application Center, and Joint Demonstration Zone. The total floor area of the buildings is 127,000 square meters on the 122,000 square meter site.

The 48th Research Institute, the project execution body under CETC, will create the equipment technology standards in China and will also make semiconductor foundries.