South Korean Hynix Semiconductor announced the availability of a 512 Megabit GDDR4 DRAM, the DRAM industry's fastest and highest density graphics memory. The graphics double...
Newly expanded E300 fab targets 54,000 wafers per month, the largest semiconductor capacity in Japan. Elpida Memory and Hiroshima Elpida Memory, announced today the completion...
Hynix Semiconductor announced the availability of DRAM first JEDEC standard 8GB DDR2 registered dual in-line memory modules by utilizing the company's multi-die stacking technology. Hynix...
Elpida announced the sample shipment of 512 Megabit DDR3 SDRAM components, 512 Megabyte Dual In-line Memory Modules (DIMMs) and 1Gigabyte DIMMs to Intel. DDR3 SDRAM...
Elpida Memory today announced availability of a 512 Megabit DDR Digital Consumer DRAM device optimized for consumer electronics applications. High-density, high-performance DRAM is becoming paramount...
Elpida Memory announced the development of 512 Megabit DDR3 SDRAM--the next-generation memory for computing applications such as notebooks, desktop PCs and servers. The new DDR3...
Unprecedented Speed -- Combined with High Density -- and Thin Form-factor Will Enable a New Generation of High-Performance Servers Elpida Memory, Inc. (Elpida), Japan's leading...
Elpida's highest density and thinner module design for server main memory offer unprecedented speed - combined with high density - and thin form-factor will enable...