Skype is expected to announce a deal soon with wireless service provider 3 to sell the Internet telephony company's first mobile phone, Reuters reported on...

Elpida and UMC today announced a joint development program for advanced DRAM with copper low-k backend, as well as for phase-change random access memory (PRAM)...

Japanese Elpida Memory, Inc. and Rambus today introduced the industry's fastest DRAM, the 512 Megabit (Mb), 4.8GHz XDR DRAM, based on Rambus' XDR memory architecture...

Elpida Memory, Inc. announced today that it has achieved the world's first ultra-fast 2-Gigabit DDR2 SDRAM featuring a speed of 1066Mbps. The new high-performance DRAM...

South Korea's Hynix Semiconductor Wednesday unveiled a plan to become the world's top chipmaker in 10 years through aggressive investment in next-generation products. Its president...

Hynix Semiconductor today announced it has received the industry?s first validation on its DDR3 memory components and modules from Intel. Hynix?s newly-validated DDR3 products are...

Akita Elpida Memory, Inc. said it has developed the world's thinnest Multi Chip Package (MCP) with 20 stacked dies. To achieve 30 ΅m thick chips...

Hynix Semiconductor and Toshiba announced today that they have signed patent cross licensing and product supply agreements covering semiconductor technology. Under the agreements, Hynix and...

Hynix Semiconductor has developed a 185MHz 512Megabit mobile DDR SDRAM with ECC (Error Correction Code). The built in ECC, similar to that used in NAND...

South Korea's major memory chipmakers Samsung and Hynix Semiconductor plan to mass-produce drastically improved memory chips this year using the 60-nano technology, industry sources said...