Other World Computing (OWC) announced today its new OWC Media Center Solution for the 2010 Mac mini. The OWC Media Center Solution includes installing the...
OCZ Technology today announced the latest Z-Drive R3 PCI-Express SSD solution for enterprise and OEM clients. Showcased for the first time at CES 2011, the...
Taiwan Semiconductor Manufacturing Company said on Thursday that it plans to have a trial production line using 18-inch wafers ready by 2013 or 2014, in...
AMD today announced its AMD E-350 APU demonstrated a significant reduction in the overall product "carbon footprint" as compared to a previous generation product featuring...
Globalfoundries talked about its plans to start volume production using 28-20nm process technologies and also to expand its production capacity, at a press conference held...
At the International Solid State Circuit Conference (ISSCC), which will be held in San Francisco from Feb. 20-24, Intel will discuss its next-generation Itanium chip...
Intel's first chipset that will natively support the USB 3.0 interface will eventually come not before 2012, according to the company's current plans. According to...
Toshiba Storage Device Division today announced its largest capacity 1.8-inch (4.6cm) form factor HDD in a 5mm height to date. At 220 GB the MK2239GSL...