The agreement provides TSMC access to optimize the implementation of ARM processors on TSMC process technologies, including ARM Cortex processor family and CoreLink interconnect fabric for AMBA protocols. It also establishes a long-term relationship with ARM for the development of physical IP, including memory products and standard cell libraries targeting the most advanced TSMC 28nm and 20nm processes.
"The signing of this agreement is a significant semiconductor industry milestone because it formalizes a forward looking, long-term relationship between two of the industrys leading companies," explained Mike Inglis, executive vice president and general manager, ARM Processor Division. "I am pleased that ARM and TSMC will be working together to enable ARM processor based SoCs leveraging both companies advanced technologies."
ARM and TSMC will collaborate on creating TSMC technology optimized processor core implementations for benchmarking of optimal power, performance and area. Typical implementations will target consumer-centric market segments including wireless, portable computing, tablet PCs and high performance computing.
"We believe this effort will enhance the value of our Open Innovation Platform that efficiently empowers innovation throughout the supply chain," said Dr. Fu-Chieh Hsu, Vice President of Design and Technology Platform and Deputy Head of R&D at TSMC. "The combination of ARMs industry leading IP and TSMCs world-class technology and manufacturing provides our mutual customers with compelling benefits for advanced semiconductor applications."
"Through our industry leadership in processor and physical IP and our strategic alliances with leading foundries and EDA companies, ARM is enabling faster time to volume production of SoCs," said Simon Segars, executive vice president and general manager, ARM, Physical IP division. "This new agreement assures the industry that ARM and TSMC will collectively provide IP development leadership for advanced process technologies well into the future."