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Ingenic Introduces MIPS-based M200 chip and Newton2 Platform for Wearables

Ingenic Introduces MIPS-based M200 chip and Newton2 Platform for Wearables

Enterprise & IT Nov 12,2014 0

Chinese company Ingenic has released the Ingenic Newton2 MIPS-based development platform targeting a wide range of connected consumer devices, including wearables. Earlier this year the company had released the Ingenic Newton platform. This board was powered by an Ingenic JZ4775 chip which included a MIPS32-based XBurst single-core processor clocked at 1 GHz.

The new Ingenic Newton2 is a small hardware module that measures 15 x 30 mm, achieving a 50% reduction in area. It integrates the main application processor, eMCP memory, a smart power management controller, on-board Wi-Fi and Bluetooth connectivity, and a MEMS sensor, together with seven dedicated connectors for the usual interfaces (display, audio, camera etc.)

The board runs the latest version of the Android and Linux operating systems.

Battery life has also been improved significantly: standby power consumption for Newton2 is less than 3mW, allowing devices to work for twice as long.

Target applications include smartwatches, augmented reality headsets, smart glasses, smart cameras, wearable healthcare monitors, fitness bands, activity trackers, smart clothing, sleep sensors, and more.

The Ingenic Newton2 features Ingenic M200, a new chipset that implements an architecture designed for the low power and reduced area requirements of wearables.

The dual-core MIPS-based XBurst application processor implements a power-saving hardware architecture where a high-performance MIPS CPU clocked at 1.2 GHz tackles most of the heavy lifting, while less demanding tasks are handled by a secondary low-power 300 MHz MIPS CPU.

When in full operating mode, the M200 chip consumes only 150mW. Additionally, M200 includes special fabric that creates multiple low power modes of operation and distinct power islands; these islands can also be switched on by special programmable triggers (e.g. voice activation).

The multimedia department sees the addition of a 3D graphics engine that supports OpenGL ES 2.0. M200 also integrates a dedicated, multi-standard video engine for low power decoding and encoding of popular codecs like H.264 and VP8 (up to 720p at 30 fps).

Finally, the chipset also includes an ISP for image pre-processing that supports a range of vital features for camera vision applications:

  • Wide Dynamic Range (EDR), dual-stream processing
    Video and still image stabilization
    Image cropping and rescaling
    Auto exposure and gain control
    Auto focus control and advanced noise reduction
    Color correction and management

Newton2 Specifications

PHYSICAL

Form factor

A modular board with 7 external connectors

Dimensions

15 x 30 x 2.4 mm

COMPONENTS

Processor

Ingenic dual-core M200 SoC, one core up to 1.2 GHz, the other core up to 300MHz

  • GPU: 3D with OpenGL ES 2.0/1.1 and OpenVG 1.1
  • VPU: H.264 720P@30fpsencoding and decoding
  • ISP for image pre-processing

Memory

eMCP (4GB eMMC + 4Gb LPDDR2)

PMIC

Ricoh RC5T619 power management IC

Wi-Fi

Broadcom 43438 single-band 2.4GHz IEEE 802.11b/g/n

Bluetooth

Bluetooth 4.1 (Bluetooth Low Energy), 2.1 + EDR

Sensor

InvenSense MPU-9250, 9-axis gyroscope + accelerometer + magnetometer

USB 2.0

Micro USB device

UART

Serial debug port

Clocks

24MHz, 32.768kHz; 26MHz (Wi-Fi/BT)

EXTERNAL CONNECTORS

Display (24-pin)

MIPI-DSI and power signals for 32020 1.63" AMOLED module

Touch (14-pin)

Power and interrupt signals for capacitive touch screen

Audio (14-pin)

DMIC and AOHPL/R

Camera (16-pin)

MIPI-CSI and I2C

Button (14-pin)

POWER, BOOT_KEY, BOOT_SEL1

GPS/Sensor (18-pin)

UART, I2C, GPIO

RF Connect (4-pin)

Wi-Fi and 2.4GHz BT antenna

POWER

Input

Li-on battery: 3.7~4.2V; Micro USB: 5.0V

Power consumption

  • CPU full-working: 0.07mW/MHz
  • Board standby (No radios): 2mW

SOFTWARE

Supported OS

Android 4.4, Linux 3.10

Code availability

Open source

Ingenic M200 specifications

Architecture
  • MIPS32 Release 2
  • XBurst SIMD

Pipeline

9-stage, single issue

Dhrystone

2.0 DMIPS/MHz

MMU

  • 32 dual-entry full associative joint TLB
  • 4 entry ITLB
  • 4 entry DTLB

Cache

  • 32KB/64KB L1 cache
  • 256KB/512KB L2 cache

Debug

EJTAG

Process

0.18um, 90nm, 65nm, 40nm

Performance and

Power consumption

  • (1.0GHz, 0.09mW/MHz) @65nmLP
  • (1.2GHz, 0.07mW/MHz) @40nmLP, performance optimized
  • (500MHz, 0.05mW/MHz) @40nmLP, power optimized

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