Micron Releases 2 Gb and 4 Gb, 1GHz DDR3-2133 Memory Kits
Micron Technology today introduced a new class of 1 GHz,
2-gigabit (Gb) and 4 Gb, 30-nanometer (nm) DDR3 devices,
strengthening the company's DDR3 portfolio.
Designed for the high- performance networking and
discrete graphics markets, the new devices feature low
power use while delivering speeds up to 2133
megatransfers per second (MT/s).
Optimized for the discrete graphics and high-speed networking markets, the new DDR3 devices provide the latest SoCs/GPUs with bandwidth required for this space. AMD and LSI are among Micron's technology and IP partners for these products, both having worked closely with Micron throughout the development process.
In addition to components that satisfy both the discrete graphics and networking segments, Micron will offer 2133 megatransfers per second (MT/s) module form factors, including networking-specific ECC UDIMMs.
Samples of Micron's new class of DDR3 devices are available now, with volume production ramping by summer.
Optimized for the discrete graphics and high-speed networking markets, the new DDR3 devices provide the latest SoCs/GPUs with bandwidth required for this space. AMD and LSI are among Micron's technology and IP partners for these products, both having worked closely with Micron throughout the development process.
In addition to components that satisfy both the discrete graphics and networking segments, Micron will offer 2133 megatransfers per second (MT/s) module form factors, including networking-specific ECC UDIMMs.
Samples of Micron's new class of DDR3 devices are available now, with volume production ramping by summer.
