Rambus Signs Agreement with STMicroelectronics
Rambus has signed a license agreement with STMicroelectronics, which expands the ST relationship with CRI, furthering its adoption of DPA countermeasures into multimedia chipsets and accelerating its support for CryptoFirewall core technology.
In addition, the agreement provides ST with access to Rambus? memory and interface technologies for inclusion in any ST products as well as exploration of further opportunities for collaboration. The companies have also settled all outstanding claims, including pending disputes related to Rambus? patented technologies.
As a result of the agreement, ST will expand deployment of CRI?s differential power analysis (DPA) countermeasures and CryptoFirewall security core technology across a wide range of its semiconductor products. The agreement also covers the use of Rambus' patented memory interface and serial link technologiess. Additionally, Rambus will have access to ST?s Fully Depleted Silicon On Insulator (FD-SOI) process technology design environment, enabling Rambus to benefit from reduced silicon geometries and lower power consumption at 28nm and below in its future Memory and Interface solutions.
As a result of the agreement, ST will expand deployment of CRI?s differential power analysis (DPA) countermeasures and CryptoFirewall security core technology across a wide range of its semiconductor products. The agreement also covers the use of Rambus' patented memory interface and serial link technologiess. Additionally, Rambus will have access to ST?s Fully Depleted Silicon On Insulator (FD-SOI) process technology design environment, enabling Rambus to benefit from reduced silicon geometries and lower power consumption at 28nm and below in its future Memory and Interface solutions.
