Intel launched Intel Core processors with Intel Hybrid Technology, code-named “Lakefield.”

Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for...

Intel has published a blog post adn a pisture of the upcoming Lakefield hybrid CPUs - a fingernail-size Intel chip with Foveros technology.

These Hybrid...

Intel is providing a sneak peek of its upcoming Lakefield client platform, based on the Foveros 3D packaging technology, detailed at CES 2019.
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On the eve of CES, Intel executives took to the stage to talk about new integrated platform that will feature Intel's upcoming first volume 10nm...

Intel demonstrated a new 3D packaging technology for face-to-face stacking of logic, scheduled to be available in the second half of next year. The company...