Intel launched Intel Core processors with Intel Hybrid Technology, code-named “Lakefield.”

Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility for ultra-light and innovative form factors.

Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size and extended battery life (Intel Core i5-L16G7 compared to Intel Core i7 8500Y processor), providing OEMs more flexibility in form factor design across single, dual and foldable screen devices.
They are the first Intel Core processors shipping with attached package-on-package (PoP) memory, further reducing board size.

They are also the first Intel Core processors to deliver as low as 2.5mW of standby SoC power – an up to 91% reduction compared to Y-series processors – for more time between charges (Intel Core™i5-L16G7 compared to Intel Core i7-8500Y).

The new processors also feature native dual internal display pipes, making them suited for foldable and dual-screen PCs.

Two designs powered by the Intel Core processors with Intel Hybrid Technology and co-engineered with Intel include the Lenovo ThinkPad X1 Fold, the first fully functional PC with a folding OLED display unveiled at CES 2020 and expected to ship this year, and the Intel-based Samsung Galaxy Book S expected in select markets starting in June.

Intel said that the base frequency is the unified frequency across all five cores, and the single core turbo frequency applies only to the big Sunny Cove core. Support for LPDDR4X-4266 is a notch above the memory controller in Ice Lake, which only runs at LPDDR4X-3733, and the memory speed will likely be a big boost to performance.

Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications.

With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area – now only a miniscule 12x12x1 mm, approximately the size of a dime – by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.

Enabling real-time communication between the CPU and the OS scheduler to run the right apps on the right cores, the hybrid CPU architecture helps deliver up to 24% better performance per SOC power (measured by WebXPRT3 score per Watt on Intel Core i5-L16G7 vs. Intel Core i7-8500Y) and up to 12% faster single-threaded integer compute-intensive application performance (measured by SPEC CPU2006 on Intel Core i5-L16G7 vs. Intel® Core i7-8500Y).

The new chips also offer more than 2x throughput on Intel UHD for AI-enhanced workloads, as measured by MLPerf v0.5 Inference with Offline Scenario using OpenVINO 2020.R2 framework Closed ResNet50-v1.5 offline FP16 GPU (Batch=128) workload on Intel Core i5-L16G7 versus Intel Core i7-8500Y:

In addition, Gen11 graphics delivers seamless media and content creation on the go – the biggest leap in graphics for Intel processor-based 7-watt systems. Intel promises that you'll be able to convert video clips up to 54% faster, (as measured by Handbrake RUG 1213 on Intel Core™ i5-L16G7 vs. Intel Core™ i5-8200Y) and with support for up to four external 4K displays.

Last but not least, the chips support Intel Wi-Fi 6 (Gig+) and Intel LTE solutions.