Intel has published a blog post adn a pisture of the upcoming Lakefield hybrid CPUs - a fingernail-size Intel chip with Foveros technology.
These Hybrid CPUs leverage Intel's Foveros 3D-stacking tech to mix power-efficient 'Tremont' cores with a performance scalable 10 nm 'Sunny Cove' core. Devices such as the Microsoft Surface Neo, as well as Samsung (Galaxy Book S) and Lenovo (ThinkPad X1 Fold) designs, are expected to come packing Intel Lakefield processors later this year.
With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel’s Foveros advanced packaging technology allows Intel to “mix and match” technology IP blocks with various memory and I/O elements – all in a small physical package for significantly reduced board size. The first product designed this way is “Lakefield,” the Intel® Core™ processor with Intel hybrid technology.
Intel says that Lakefield "represents an entirely new class of chip. It delivers an optimal balance of performance and efficiency with best-in-class connectivity in a small footprint." Lakefield’s package area actually measures just 12-by-12-by-1 millimeters.
These benefits offer original equipment manufacturers flexibility for thin-and-light form factor PCs, including the emerging dual-screen and foldable screen PC categories.
The current Lakefield chip that appears to be in testing by various Intel partners mixes Tremont and Sunny Cove cores in a 4+1 configuration.