VIA Launches HDTV ready Unified Chipset for Embedded Market
The VIA CX700M leverages VIA's design strengths in silicon integration and energy efficient design to enable embedded innovation with advanced multimedia support VIA Technologies today...
Shuttle Launches the XZ890G2 Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions Kioxia Announces New SSD Model Optimized for AI GPU-Initiated Workloads ASUS Republic of Gamers Strix Laptop Lineup Returns With the Latest Intel Core Ultra 9 290HX Plus Processors ASUS Announces 2026 TUF Gaming Laptop Lineup
Integrated with the Intel...