JEDEC announces Universal Flash Storage (UFS) 4.0 specs
JEDEC Solid State Technology Association announced the publication of JESD220F: Universal Flash Storage 4.0. In addition, an update to the complementary JESD223E UFSHCI 4.0 standard,...
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JEDEC Solid State Technology Association announced the publication of JESD220F: Universal Flash Storage 4.0. In addition, an update to the complementary JESD223E UFSHCI 4.0 standard,...
Samsung Electronics, the world leader in advanced memory technology, today unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held...
JEDEC Solid State Technology Association has made available the Universal Flash Storage (UFS) version 3.1, JESD220E.
In addition, an optional new companion standard, JESD220-3:...
Toshiba Memory has started sampling the first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices.
The new lineup utilizes the company’s 96-layer BiCS...
Samsung has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with features based on automotive specifications from the JEDEC...
Samsung Electronics has begun mass production of the first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices.
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