JEDEC Updates the Universal Flash Storage (UFS) Standard
JEDEC Solid State Technology Association has made available the Universal Flash Storage (UFS) version 3.1, JESD220E.
In addition, an optional new companion standard, JESD220-3:...
Qualcomm Redefining Wireless Audio with Launch of Qualcomm Snapdragon Sound ASUS announces the ROG Strix, TUF Gaming and Dual AMD Radeon RX 6700 XT graphics card series Leica announces The APO-SUMMICRON-M 35 f/2 ASPH GIGABYTE Launches Radeon RX 6700 XT series graphics cards Samsung Announces Galaxy XCover 5, the Newest Durable and Advanced Smartphone Built for Tough Environments
JEDEC Solid State Technology Association has made available the Universal Flash Storage (UFS) version 3.1, JESD220E.
In addition, an optional new companion standard, JESD220-3:...
Toshiba Memory has started sampling the first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices.
The new lineup utilizes the company’s 96-layer BiCS...
Samsung has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with features based on automotive specifications from the JEDEC...
Samsung Electronics has begun mass production of the first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices.
...