Kioxia Unveils 5th-Generation 112-layer BiCS FLASH
Kioxia Corp. and its technology and manufacturing partner Western Digital Corp have developed their fifth-generation BiCS FLASH three-dimensional (3D) flash memory with a 112-layer vertically...
Toshiba Unveils 1TB Single Package PCIe Gen3 x4L SSDs with 96-Layer 3D Flash Memory
Today at CES Toshiba Memory America introduced the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the...
Toshiba to Showcase BiCS FLASH 3D Flash Memory at CES 2019
CES 2019 will see Toshiba Memory debut a new lineup of ultra-compact, single package NVMe SSDs that bring flexibility to the design of ultra-thin notebooks,...
Toshiba to Prepare New Semiconductor Fabrication Facility
Toshiba is going ahead with a forward-looking plan for a new memory fabrication facility in Kitakami, Iwate prefecture.
Toshiba Memory Corporation (TMC), a...
Toshiba Demonstrates 64-Layer BiCS FLASH on Client NVM Express SSD
Toshiba will debut its demonstration of the new 64-layer BiCS FLASH 3D technology on an XG Series client Non-Volatile Memory Express 2 (NVMe) Peripheral...
