Toshiba to Showcase BiCS FLASH 3D Flash Memory at CES 2019
CES 2019 will see Toshiba Memory debut a new lineup of ultra-compact, single package NVMe SSDs that bring flexibility to the design of ultra-thin notebooks, embedded systems and boot storage applications for servers and data centers.
Making its public debut at CES, TMA’s BG4 series – a new lineup of ultra-compact, single-package NVMe SSDs – places both the flash and controller in one package, bringing flexibility to the design of ultra-thin notebooks, embedded systems and boot storage applications for servers and data centers. The BG4 series leverages TMA’s 96-layer BiCS FLASH.
Demonstrations are located in Toshiba Memory America’s private demo suite at The Venetian Resort (Toscana 3704) from January 8 – 11, and include:
- BG4 series of ultra-compact, single-package NVMe SSDs
- Enterprise, Client and Data Center SSDs
- KumoScale software
- Qualcomm Snapdragon 845 Mobile Development Platform with Toshiba UFS
- Qualcomm Snapdragon 820A Automotive Development Platform with Toshiba UFS
