Toshiba will debut its demonstration of the new 64-layer BiCS FLASH 3D technology on an XG Series client Non-Volatile Memory Express 2 (NVMe) Peripheral Component Interconnect Express 3 SSD at Dell EMC World 2017.

Toshiba will showcase a laptop containing a prototype XG-series NVMe PCIe SSD with a total of 1TB of BiCS3 3D TLC NAND. The XG3 series is the OEM counterpart to the OCZ RD400 consumer NVMe drives.

Toshiba's BiCS FLASH is a three-dimensional (3D) flash memory stacked cell structure suitable for applications that require high capacity and performance, such as enterprise and consumer SSDs. The 512 gigabit (GB5) (64 gigabyte), 64-layer device with 3-bit-per-cell (TLC) technology was recently added to Toshiba's BiCS FLASH memory product line. The new BiCS FLASH is based on the third generation 64-layer stacking process featuring 65 percent greater bit density per mm2 than the company's 48-layer, 256GB (32 gigabyte) device.

Toshiba is also currently migrating all client, data center and enterprise SSDs to the newest BiCS FLASH 64-layer 3D memory.