IBM, Chartered Semiconductor Manufacturing, Infineon Technologies, and Samsung Electronics Co., Ltd. today announced first silicon-functional circuits and the availability of design kits based on their...

OCZ Technology unveilled the PC2-9000 Ti Alpha VX2 DFI Special Edition, an exclusively engineered series of memory optimized for the new DFI LANParty UT NF590...

Verbatim's new line of Store 'n' Go Corporate Secure USB Flash Drives designed to protect all data contents with mandatory security features. Based on Verbatim's...

Cadence Design Systems announced that Toshiba has adopted Cadence QRC Extraction for its most advanced 65nm design flows. Cadence QRC Extraction provides silicon-accurate parasitic extraction...

High-end desktop PCs will sport quad-core processors from Intel as the fourth quarter gets under way. The Santa Clara, Calif., company, which pulled forward the...

Fujitsu announced the new MHW2 BH series of hard disk drives (HDDs) for mobile PCs, its first 2.5" HDD offerings to incorporate perpendicular magnetic recording...

Corsair Memory unveiled its latest developments in high performance module design, Dual-path Heat Xchange (DHX) technology. The technology will be available in the latest memory...

Toshiba today announced the forthcoming introduction of TransMemory USB Flash Memories that will bring U3TM platform technology into the company's USB lineup and introduce a...

Samsung announced today mass production of 1Gigabit (Gb) DDR2 DRAM memory using 80 nanometer (nm) process technology. While monolithic 1Gb DDR2 is available today, it...

One month after Intel debuted the desktop version of its all-new-architecture Core 2 Duo processor, the chipmaker has launched a mobile version. The dual-core processor...