Samsung Electronics said Tuesday it has begun mass production of the world's highest-capacity multi-chip (MCP) package for high-end mobile phones. With two 1-gigabit NAND flash...

Freescale Semiconductor, Inc. (NYSE:FSL) (NYSE:FSL.B) demonstrated the world's first UWB-enabled Samsung cell phone at the 3GSM World Congress. The UWB-enabled cell phone that Samsung and...

Samsung Electronics introduced its latest range of 3G handsets: the SGH-Z500, Z130 and Z300, at the 3GSM World Congress 2005. Along with its 3G handsets,...

Vodafone has announced that it has been licensed by the Japanese Ministry of Internal Affairs and Communications to conduct field tests for High-speed Downlink Packet...

Sony Ericsson Mobile Communications AB will unveil a mobile phone-cum-digital music player early next month, company President Miles Flint announced at the 3GSM World Congress...

Motorola unveiled a range of new handsets yesterday that will be built around its RAZR model, and showed a long-awaited music phone with Apple's iTunes...

Nvidia Corp. updated its GoForce 3D chip on Monday, in preparation for the next round of 3G handsets to be shown off in Cannes.

Nvidia's...

Nokia Corp of Finland announced Monday that the world's top cellphone maker and Microsoft Corp. of the United States have agreed to collaborate on digital...

Philips Electronics announced a system-in-package (SiP) enabling TV on mobile in the fourth quarter of 2005.

The solution, based on the DVB-H standard, contains all...

Kineto Wireless, a key innovator and leading supplier of UMA Technology, and Royal Philips Electronics announced today that the two companies are working together to...