EK announces the launch of the EK-Loop Thermal Paste NGP (5g), a thermal interface material meticulously engineered for enthusiasts seeking efficient thermal transfer between high-end components and their cooler of choice. The EK-Loop Thermal Paste NGP utilizes nano-grade particles, ensuring effective heat transfer between CPUs, GPUs, and other chipsets and their respective cooling mechanisms, such as water blocks and heatsinks.

Nano Grade Technology
The cornerstone of the EK-Loop Thermal Paste NGP is its Nano Grade Particles (NGP) technology, which ensures very low thermal impedance and excellent applicability. These nano-grade particles are engineered to form an ultra-thin layer between the heat source and the cooler, promoting effective heat dissipation. The low thermal impedance is important as it allows the paste to effectively transfer heat away from critical components like CPUs and GPUs, minimizing the risk of overheating and supporting overall system performance.

Tailored for computing applications, including gaming PCs, workstations, and servers, this advanced formulation is designed for good crumpling resistance and reliable performance over extended periods. It ensures stability for users in various environments, confirming its adaptability for a range of scenarios

Thermal Stability and Reliability
EK-Loop Thermal Paste NGP exhibits exceptional thermal stability, functioning reliably within a temperature range of -20°C to 125°C. This stability is crucial for maintaining consistent performance and preventing thermal degradation over time, which is essential for long-term system efficiency. Its excellent dielectric properties ensure the paste maintains optimal performance without producing undue pressure when utilized in various applications, enhancing its thermal conductivity and long-term reliability.

User-Friendly Application
Good spreadability and ease of application are key features of the EK-Loop Thermal Paste NGP, making it exceptionally user-friendly for both seasoned enthusiasts and beginners. The product comes in a syringe with a five-gram (5g) capacity, ample for multiple uses. To enhance the application process, each package includes a high-quality black spatula designed for an even and smooth application, ensuring that the right amount of paste is applied every time.

Further details and specifications of the EK-Loop Thermal Paste NGP are outlined in the table below:

Technical specification:
Color Gray
Volatilization Rate (24H@200°C) % < 0.5
Density (g/cc) 2.98
Viscosity (mPa.s) 1000~2000
Continuous Using Temperature (°C) -20 to 125
Thermal Conductivity (W/mK) 6.9
Thermal Impedance
Thermal Impedance (°C·cm2 /W) 0.09
Pressure (psi) 40

Availability and Pricing
Designed in Slovenia, Europe, the EK-Loop Thermal Paste NGP (5g) is now available for purchase through https://www.ekwb.com/shop/ek-loop-thermal-paste-ngp-5g at 9.90€