Less than a year from the ceremonial groundbreaking on the Wisconn Valley Science and Technology Park, it seems that foundation work for Foxconn’s 988,999 square-foot Gen6 Fab facility begins.

Foxconn Technology Group and its construction manager, Gilbane | Exyte today announced that they began the concrete foundations and footing pour for the Generation 6 Fabrication (Gen6 Fab) manufacturing facility at the Wisconn Valley Science and Technology Park in Wisconsin. In the coming weeks and months, trucks will pour approximately 65,000 cubic yards of concrete at Pad A of Area 1, helping create the first thin-film-transistor liquid-crystal display (TFT-LCD) advanced manufacturing facility in North America.

Foxconn has been critisized for the slow progress of the previously announced plans to expand its U.S. presence in Wisconn.

Earlier this week, the company provided a first look at images of the planned fabrication facility through detailed diagrams and renderings tendered to the Village of Mount Pleasant Plan Commission as part of the local approval process. In recent months, Foxconn announced contract awards for site utilities and roadways, as well as the foundation work now underway, and issued invitations to bid on dozens of other packages for ongoing work at the park.

“Today marks another milestone for Foxconn in Wisconsin,” said Dr. Louis Woo, Special Assistant to Foxconn Founder Terry Gou. “The installation of foundations and footings comes after months of careful planning and preparation, which demonstrates Foxconn’s concrete commitment to advanced manufacturing in Wisconsin. We are incredibly proud of the significant progress that Foxconn has made in Wisconsin in just one year, and we look forward to continued progress towards Q4 2020.”

Gen6 foundations and footings will be poured within Area 1 of the Wisconn Valley Science and Technology Park known as Pad A. This building footprint rests upon an engineered-base that stretches approx. 1,000,000 square-feet, or approximately 17 football fields.