VIA Launches the VIA Mobile360 M810 System
To facilitate the installation of advanced safety features that reduce the risk of accidents for large vehicles, VIA is unveiled the VIA Mobile360 M810 system at Embedded World 2020.
With its AI and Computer Vision technologies, the VIA Mobile360 M810 supports a complete range of ADAS (Advanced Driver Assistance System) features including Forward Collision Warning, Blind Spot Detection, and Lane Departure Warning that give drivers real-time alerts of impending risks so that they can take immediate action to prevent potential accidents. Dynamic Moving Object Detection and Park Assistant System features can also be enabled using an FOV-190° Rear View Camera.
The system can be configured with VIA Mobile360 DMS (Driver Monitoring System) technology that automatically detects drowsiness and distractions. The driver authentication feature in the DMS further boosts safety and security using facial recognition technology.
The VIA Mobile360 M810 is available now and comprises a full set of system hardware, software, AI algorithms, cameras, and other peripherals that can be configured to meet specific deployment requirements. Its key features include:
- Ruggedized ultra-compact in-vehicle system with wide operating temperature range and 9~36V DC-in with ACC/IGN
- Six FAKRA ports enabling flexible FOV-40° and FOV-190° camera configuration options for ADAS (Advanced Driver Assistance System), DMS (Driver Monitoring System), SVS (Surround View System), and DVR (Digital Video Recording) functionality;
- Gigabit Ethernet plus optional 4G LTE, Wi-Fi, and BT4.1 connectivity;
- Rich I/O expansion capabilities, including two CAN bus ports, two USB 3.0 ports, one COM port, one HDMI port, two M.2 SATA slots, one Micro SD card slot, and one MiniPCIe slot;
- Cables and optional 10.1” projective capacitive screen
- User-friendly calibration software tool
| Model Name | VIA Mobile360 M810 |
|---|---|
| Processor | Qualcomm® APQ8096A Embedded Processor - Two high-performance Kryo cores up to 2.054GHz - Two low power Kryo cores up to 1.593GHz |
| System Memory | 4GB LPDDR4 RAM |
| Storage | 16GB eMMC flash memory 2 M.2 SATA slots |
| Graphics | Qualcomm® Adreno™ 530 GPU 3D graphics accelerator with 64-bit addressing 624MHz Graphics engine supporting OpenGL ES 3.1/GEP, GL4.4, DX11.3/4, OpenCL 2.0, Renderscript-Next Supports H.264, VP8, HEVC 8/10-bit, VP9 video decoding up to: 4K@60fps, 1080p@240fps, 8 x 1080p@30fps |
| Camera-in Interface | 2 DS90UB964-Q1 Quad FPD-Link III deserializer Hub |
| LAN | RTL8111G Ethernet Controller |
| Wireless Connectivity | AMPAK12356_I Mini PCIe WIFI/BT5.0 Module MAX-M8Q-0-10 u-blox 8 GNSS module |
| Audio | TI 6PAIC3104IRHBRQ1 Audio Codec |
| HDMI | Integrated HDMI 2.0 transmitter |
| Expansion I/O | 1 Mini PCIe slot (USB only) for 4G Module 1 Mini PCIe slot (PCIe/USB) for WiFi/BT Module |
| Front Panel I/O | 2 USB 3.0 ports 1 Micro USB 2.0 port (for debugging) 1 Micro SD card slot 1 SIM card slot (optional) 1 Power button |
| Back Panel I/O | 1 HDMI port 1 DIO port 1 COM port 2 CAN bus ports (supports up to five CAN bus) 1 Gigabit Ethernet port 6 FAKRA connectors for camera-in 1 Headphone/Mic-in connector 3 Antenna connectors for Wi-Fi/BT, GPS, and 4G (factory option) 1 4-pole Phoenix 9~36V DC-in 1 2-pole Phoenix 12V DC-out |
| Power Supply | 9~36V DC-in with IGN |
| Operating System | Yocto2.3 |
| Operating System | -20°C ~ 70°C |
| Storage Temperature | -20°C ~ 70°C |
| Operating Humidity | 0~95% (non-condensing) |
| Vibration Loading During Operation | ISO-16750-3 compliance |
| Shock During Operation | ISO-16750-3 compliance |
| Mechanical Construction | Metal chassis housing |
| Dimensions | 236.7mm(W) x 46mm(H) x 180mm(D) (9.32" x 1.81" x 7.09") |
| Weight | 2.2kg (4.85lbs) |
| Compliance | CE, FCC, BSMI |
