Intel has announced a new chip part of its 8th Gen Intel Core family, which brings together a high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD's Radeon Technologies Group.

Designed in collaboration AMD, Intel's new semi-custom graphics chip, features Embedded Multi-die Interconnect Bridge (EMIB), a cost-effective approach to in-package high density interconnect of heterogeneous chips. The industry refers to this application as 2.5D package integration. Instead of using a large silicon interposer typically found in other 2.5D approaches, EMIB uses a very small bridge die, with multiple routing layers. This bridge die is embedded as part of our substrate fabrication process.

EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.

Similarly, the power sharing framework is a new connection tailor-made by Intel among the processor, discrete graphics chip and dedicated graphics memory. Intel has added unique software drivers and interfaces to this semi-custom discrete GPU that coordinate information among all three elements of the platform. Not only does it help manage temperature, power delivery and performance state in real time, it also enables system designers to adjust the ratio of power sharing between the processor and graphics based on workloads and usages, like performance gaming. Balancing power between our high-performing processor and the graphics subsystem is critical to achieve great performance across both processors as systems get thinner.

"Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics," said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. "Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible."

Additionally, this solution is the first mobile PC to use HBM2, which consumes much less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory, like GDDR5 memory.

This new addition to the 8th Gen Intel Core processor family will power thinner, lighter devices across notebooks, 2 in 1s and mini desktops, while delivering high performance and graphics for enthusiasts.

Intel expects the new chip to launch in the first quarter of 2018.