TSMC To Invest US$1.5 billion in 2013
Taiwan Semiconductor Manufacturing Co. (TSMC) said Thursday it will invest a US$1.5 billion in 2013 to boost its capability in research and development.
The company said it will draw the funds from its 2013 capital expenditure, which it estimated will be about US$9.5 billion to US$10 billion.
The world's largest chip maker is also planning to increase its R&D staff this year from about 3,900 to 4,200.
The 2013 R&D spending will focus on logic IC and specialty chip development.
TSMC expects mobile communication devices to boost demand for electronics processors and systems-on-chip (SoC), while other integrated circuits such as image sensor chips, embedded memory chips and drive ICs are also expected to be in higher demand.
TSMC is also planning to raise the monthly production capacity at its 12-inch wafer plant in the Central Taiwan Science Park, from around 50,000 units to 100,000 units by the end of this year.
The world's largest chip maker is also planning to increase its R&D staff this year from about 3,900 to 4,200.
The 2013 R&D spending will focus on logic IC and specialty chip development.
TSMC expects mobile communication devices to boost demand for electronics processors and systems-on-chip (SoC), while other integrated circuits such as image sensor chips, embedded memory chips and drive ICs are also expected to be in higher demand.
TSMC is also planning to raise the monthly production capacity at its 12-inch wafer plant in the Central Taiwan Science Park, from around 50,000 units to 100,000 units by the end of this year.
