Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of Apple's A11 chips in April, according to a Chinese-language Economic Daily News (EDN) report.

Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of Apple's A11 chips in April, according to a Chinese-language Economic Daily News (EDN) report.

The paper clams that TSMC will be able to produce 50 million chip units of the chip before July, with capacity to double towards the end of the year.

The A11 chips, which will power the upcoming iPhone series slated for launch in September 2017, will be built on a 10 nm FinFET process and packed with a wafer-level integrated fan-out (InFO) packaging technology, said the report. TSMC?s InFO technology can bring greater than 20% reduction in overall package thickness of the chip, along with better power dissipation.

TSMC started volume production of its 10nm chips in the third quarter of 2016 and has begun to ship 10nm products to MediaTek and HiSilicon Technologies in the first quarter of 2017.