Computex: Intel Showcases Moorestone and the 32nm Medfield Platforms For Netbooks, Smart Phones
At Computex, Intel outlined progress with Intel?s next-generation "Moorestown" platform and announced that the company is on track to achieve up to 50x platform idle power reduction while reducing the board size by 2x compared to Intel?s first-generation "Menlow" platform.
This is a dramatic improvement over Intel?s previously announced target of achieving >10x power reduction, and is being made possible through a combination of architectural, design and process enhancements, according to Anand Chandrasekher, Intel Corporation senior vice president and general manager, Ultra Mobility Group.
At Computex, Intel also displayed first form factor designs from Aava Mobile, CCI, EB, Inventec and Quanta as indicators of what the "Moorestown" technology platform will make possible. Looking to the future, Chandrasekher pointed to Intel?s continued manufacturing and process leadership with 32nm and highlighted the third-generation platform, codenamed "Medfield," scheduled for introduction in 2011. Medfield will be a single chip, 32nm SoC design. It will continue substantial reductions in size and power, and extend Intel?s product offerings into smart phone segments.
Intel?s next-generation handheld platform, codenamed "Moorestown," is scheduled to launch by 2010. Intel indicated that the platform is hitting all the milestones and demonstrated up to 50x platform idle power reduction while reducing the board size by 2x compared to Intel?s first-generation "Menlow" platform. Moorestown consists of a SoC (codenamed "Lincroft") that integrates a 45nm Intel Atom processor core, 2-D/3-D graphics, video encode/decode, display controller and memory controller. The platform includes an input/output (I/O) hub, codenamed "Langwell," that features a range of interfaces including CE-ATA, MIPI and SPI interfaces, SDIO ports, USB controllers, NAND controller and audio codecs.
Moorestown will be accompanied by a newer Moblin software version, Moblin v2.0, that is based on the Linux operating system. This software is designed specifically to deliver a great PC-like Internet experience while also supporting cellular voice capabilities.
Chandrasekher showcased a number of designs during his keynote, spotlighting what Moorestown is making possible. He highlighted designs from Aava Mobile, CCI, EB, Inventec and Quanta, and demonstrated compelling 3-D UIs, HD video, interactive gaming, rich graphics and 3G voice.
Intel also spotlighted category momentum behind the company?s first-generation Atom-based mobile Internet device platform "Menlow," which to date has garnered more than 70 design wins worldwide. Chandrasekher showcased a range of Atom-based designs and announced Compal?s next-generation design, codenamed "KAX15" and based on the Windows XP OS.
Intel emphasized the inherent advantage it has around the software and Internet compatibility, and discussed the unified software stack it is able to provide across Windows and Linux-based Moblin OS to the software community. Chandrasekher discussed a number of companies which are embracing the Linux-based Moblin OS and developing their middleware and applications for Moorestown-based MIDs.
Sneak Peek into 32nm "Medfield" Platform
Intel?s third-generation platform is codenamed "Medfield" and scheduled for 2011. "Medfield" will be a single chip, 32nm SoC design. It will continue substantial reductions in size and power over previous generations and extend Intel?s product offerings into smart phone segments.
At Computex, Intel also displayed first form factor designs from Aava Mobile, CCI, EB, Inventec and Quanta as indicators of what the "Moorestown" technology platform will make possible. Looking to the future, Chandrasekher pointed to Intel?s continued manufacturing and process leadership with 32nm and highlighted the third-generation platform, codenamed "Medfield," scheduled for introduction in 2011. Medfield will be a single chip, 32nm SoC design. It will continue substantial reductions in size and power, and extend Intel?s product offerings into smart phone segments.
Intel?s next-generation handheld platform, codenamed "Moorestown," is scheduled to launch by 2010. Intel indicated that the platform is hitting all the milestones and demonstrated up to 50x platform idle power reduction while reducing the board size by 2x compared to Intel?s first-generation "Menlow" platform. Moorestown consists of a SoC (codenamed "Lincroft") that integrates a 45nm Intel Atom processor core, 2-D/3-D graphics, video encode/decode, display controller and memory controller. The platform includes an input/output (I/O) hub, codenamed "Langwell," that features a range of interfaces including CE-ATA, MIPI and SPI interfaces, SDIO ports, USB controllers, NAND controller and audio codecs.
Moorestown will be accompanied by a newer Moblin software version, Moblin v2.0, that is based on the Linux operating system. This software is designed specifically to deliver a great PC-like Internet experience while also supporting cellular voice capabilities.
Chandrasekher showcased a number of designs during his keynote, spotlighting what Moorestown is making possible. He highlighted designs from Aava Mobile, CCI, EB, Inventec and Quanta, and demonstrated compelling 3-D UIs, HD video, interactive gaming, rich graphics and 3G voice.
Intel also spotlighted category momentum behind the company?s first-generation Atom-based mobile Internet device platform "Menlow," which to date has garnered more than 70 design wins worldwide. Chandrasekher showcased a range of Atom-based designs and announced Compal?s next-generation design, codenamed "KAX15" and based on the Windows XP OS.
Intel emphasized the inherent advantage it has around the software and Internet compatibility, and discussed the unified software stack it is able to provide across Windows and Linux-based Moblin OS to the software community. Chandrasekher discussed a number of companies which are embracing the Linux-based Moblin OS and developing their middleware and applications for Moorestown-based MIDs.
Sneak Peek into 32nm "Medfield" Platform
Intel?s third-generation platform is codenamed "Medfield" and scheduled for 2011. "Medfield" will be a single chip, 32nm SoC design. It will continue substantial reductions in size and power over previous generations and extend Intel?s product offerings into smart phone segments.
