Breaking News

G.SKILL Announces T5 Neo Series DDR5-6400 CL38 512GB (64GBx8) Overclocked R-DIMM Memory Kit with AMD EXPO Support for AMD Ryzen Threadripper PRO Workstations ZOTAC to Launch GeForce RTX 5090 ARCTICSTORM AIO & GeForce RTX 5060 Low Profile KIOXIA Commences Sample Shipments of 9th Generation BiCS FLASH 512Gb TLC Devices Synology Unveils DiskStation DS225 Plus New PS5 system update beta previews DualSense wireless controller pairing across multiple devices

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Intel Says Is On Track To Make 10 nm Chips

Intel Says Is On Track To Make 10 nm Chips

Enterprise & IT Sep 13,2012 0

Intel says that creating chips using the advanced 10 nm process technology is feasible by using the immersion lithography. In addition, the company is on track to start making chips in a 14 nm process technology before the end of next year. Generally, transition scaling provides improvements in power and cost, but now with greater focus on power reduction. Scaling no longer follows a "classical" path and requires continued innovations in materials and structures. Specifically, a highly integrated approach is needed to succesfully bring innovative technologies from the research phase to high volume manufacturing.

Mark Bohr, director of Intel's technology and manufacturing group, said at IDF 2012 that the 10 nm process would debut in 2015 or later. Although the company has provided details on how it would proceed with the new demanding manufacturing processes, Bohr said it would require quadruple patterning for some mask layers. The company has also agreed to invest $4.1 billion in ASML to drive extreme ultraviolet (EUV) lithography forward.

Intel expects to use double patterning in some layers of some chips at 14 nm. If immersion is used at 10 nm, more layers will require double patterning and some will even require quadruple patterning, he said.

Multiple patterning means increased wafer costs, but Bohr claims that the cost will be offset by the improved transistor density.

Intel showcased the following picture showing the potential technologies that will be used in making 10nm chips. These are based around photonics, graphene, materials synthesis, dense memory, nanowires, extreme ultra violet lithography (EUV) and updated tri-gate transistors.



Intel's research group are also exploring technologies for 7nm and 5nm solutions.

Process development requires huge investments, but it also provides huge economic advantages for Intel.

ARM licenses its chips and they are made in foundries operated by Samsung, the Taiwan Semiconductor Manufacturing Company, and GlobalFoundries. AMD uses GlobalFoundries. Intel seems to have a three year lead over these companies in terms of process.

Tags: Intel
Previous Post
Nintendo 8GB Wii U Will Be Available In November For $300
Next Post
Intel Focuses On Software Developers, Announces New HTML5 Tools

Related Posts

  • An Intel-HP Collaboration Delivers Next-Gen AI PCs

  • New Intel Xeon 6 CPUs to Maximize GPU-Accelerated AI Performance

  • Intel Unveils New GPUs for AI and Workstations at Computex 2025

  • G.SKILL Releases DDR5 Memory Support List for Intel 200S Boost

  • Intel and its partners release BIOS update for Intel 15th Gen to increase performance

  • Intel-AMD new motherboards announced

  • Intel at CES 2025

  • Intel Launches Arc B-Series Graphics Cards

Latest News

G.SKILL Announces T5 Neo Series DDR5-6400 CL38 512GB (64GBx8) Overclocked R-DIMM Memory Kit with AMD EXPO Support for AMD Ryzen Threadripper PRO Workstations
PC components

G.SKILL Announces T5 Neo Series DDR5-6400 CL38 512GB (64GBx8) Overclocked R-DIMM Memory Kit with AMD EXPO Support for AMD Ryzen Threadripper PRO Workstations

ZOTAC to Launch GeForce RTX 5090 ARCTICSTORM AIO & GeForce RTX 5060 Low Profile
GPUs

ZOTAC to Launch GeForce RTX 5090 ARCTICSTORM AIO & GeForce RTX 5060 Low Profile

KIOXIA Commences Sample Shipments of 9th Generation BiCS FLASH 512Gb TLC Devices
Enterprise & IT

KIOXIA Commences Sample Shipments of 9th Generation BiCS FLASH 512Gb TLC Devices

Synology Unveils DiskStation DS225 Plus
Enterprise & IT

Synology Unveils DiskStation DS225 Plus

New PS5 system update beta previews DualSense wireless controller pairing across multiple devices
Gaming

New PS5 system update beta previews DualSense wireless controller pairing across multiple devices

Popular Reviews

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Noctua NH-D15 G2

Noctua NH-D15 G2

Soundpeats Pop Clip

Soundpeats Pop Clip

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

be quiet! Pure Base 501

be quiet! Pure Base 501

Terramaster F8-SSD

Terramaster F8-SSD

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed