China To Invest In 3D NAND Flash Plant
Chinese semiconductor firm XMC will be responsible for production. XMC has already produced a small quantity of flash memory chips and has joined hands with chip design firm Spansion to intensify its research on 3D NAND.
A ground-breaking ceremony for new plant will be held on March 28, and mass production of 3D NAND is expected to start in 2017.